® Redux 308 Modified epoxy film adhesive Description Product Data Redux® 308 is a high-strength film adhesive curing at 340°F. It is suitable for a wide range of structural bonding applications including metal to metal bonding and sandwich constructions, where operating temperatures of up to 250°F may be experienced. Features Cures at 340°F Good structural performance and service temperatures up to 250°F Excellent environmental resistance Superior aging performance for continuous operations up to 250°F Low volatile content (solventless process) Applications Metal to metal bonding Structural sandwich constructions Forms Black unsupported epoxy film with a paper release backing and a polyethylene interleaving. Product Description Areal Weight psf Roll Width in. Standard Roll ft2 Redux® 308 0.06 39 540 Instructions For Use Pretreatment It is essential that all substrates to be used are free of contamination and are in as ideal a state for bonding as possible. As pretreatment varies significantly depending on the substrates used, please refer to the Hexcel publication, Redux® Bonding Technology, for optimum procedures. If there is to be a delay between the pretreatment and bonding of aluminum, the pretreated surface should be protected with Redux® 108 surface pretreatment protection solution to conserve the optimum bonding surface. This will enable bonding to be delayed for up to 2 weeks without deterioration of the pretreated surface. The correct application of Redux® 108 should not alter the bonding performance of Redux® 308 (for full application details consult the relevant data sheet). © ® Copyright Hexcel Corporation Redux, Hexcel and the Hexcel logo are registered trademarks of Hexcel Corporation, Stamford, Connecticut

Redux® 308 Product Data Application 1. Allow sufficient time for the adhesive to warm to room temperature (60°F-80°F) before removing the protective polyethylene. 2. Cut the film to the shape and size required. 3. Remove the release paper and position the adhesive on the prepared bonding surface. 4. Remove the polyethylene backing sheet. 5. Complete the joint assembly and apply pressure while the adhesive is being cured. For sandwich structures the pressure application should be selected to suit the type of core used. After the adhesive has cured it is advisable to maintain pressure on the...

Modified epoxy film adhesive Redux® 308 has been formulated for maximum storage life consistent with Its high performance. Certain precautions, however, will help to enhance that storage life as follows: 1. When stored at room temperature (less than 80°F) it should be kept on a horizontal mandrel passed through the tube core on which the roll Is wound. This avoids the risk of local thinning of the film under the weight of the roll. 2. When storing under refrigeration the original packaging should be retained if possible. When returning to the refrigerator after use, It is essential to protect...

Redux® 308 Product Data Release Certification The Quality System at Hexcel Composites Duxford has been certified to ISO 9001 by Lloyd’s Register Quality Assurance, and is approved by the UK Civil Aviation Authority and Ministry of Defense. Certificates of Conformity and Test Reports can be issued for batches of Redux® 308 on request. Important Hexcel Corporation believes, in good faith, that the technical data and other information provided herein is materially accurate as of the date this document is prepared. Hexcel reserves the right to modify such information at any time. The performance...