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HexMC®-i / C / 2000 / M81

HexMC®-i / C / 2000 / M81

HexMC®-i / C / 2000 / M81

Product catalog summary
Description
HexMC®-i is a high-performance carbon moulding composite designed for compression moulding. It features an epoxy matrix and high carbon fibre volume, making it suitable for a wide range of applications. Key features include being a competitive alternative to lightweight metal alloys, rapid processing cycles, capability for complex shapes, moulded-in inserts, no material waste, and elevated temperature performance with a glass transition temperature (Tg) up to 210°C.
Presentation
The product is presented as a roll with an areal weight of 2000 g/m², roll width of 460mm, and fibre length of 50 mm. It has a shelf life of 12 months at -18°C and 3 weeks at room temperature (23°C). The material density is 1.55 g/cm³ with a nominal fibre volume of 57%. Typical cure temperature is 180ºC with a cure time of 20 minutes.
Recommendations for Use
1. Allow HexMC®-i to warm to room temperature from the freezer.
2. Clean the mould and apply a release agent.
3. Heat the mould to 180°C and adjust pressure based on part complexity.
4. Remove protective film and cut HexMC®-i to size.
5. Perform a staging step in an oven to optimize flow.
6. Load the product into the mould, covering approximately 80% of the area.
7. Apply pressure and hold for the appropriate cure time.
8. After curing, release the part using ejector pins if available.
Mechanical Properties
Data from tests on cured laminates show nominal values for tensile strength (300 MPa), ILSS (80 MPa), and compression strength (325 MPa). Modulus values are 42 GPa for tensile and 35 GPa for compression. The glass transition temperature is 165°C for a 20-minute cure at 180°C and 210°C with an additional 2-hour post-cure.
Storage and Handling
Store in sealed packaging at –18°C and allow to reach room temperature before use to prevent condensation. Use clean disposable gloves to avoid contamination. HexMC®-i flow improves with heat, and staging is recommended for optimal formability.
Important
Information is provided without liability, and users should assess product suitability for their needs. Sales are subject to standard terms, including liability limitations.
Contact Information
For US inquiries, call 1-800-688-7734. For global sales offices, visit the Hexcel website.
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Catalog excerpts

HexMC®-i / C / 2000 / M81-1

HexMC®-i Moulding Concept Carbon Epoxy HexMC®-i / C / 2000 / M81 Product Data Description HexMC®-i is a high performance carbon moulding composite, specifically designed for compression moulding. The epoxy matrix and high carbon fibre volume content enable components to be moulded for a wide range of applications. Overall features n n n n n n n Competitive alternative to lightweight metal alloys (Al, Mg, Ti). Designed for compression moulding. Rapid processing cycles. Complex shapes. Moulded-in inserts. No material waste. Elevated temperature performance (Tg up to 210°C). Form: Roll Roll width: 460mm Shelf life at -18°C: 12 months Shelf life at RT 23°C: 3 weeks Material density: 1.55 g/cm3 Typical cure temperature: 180ºC Resin ID Areal weight (g/m²) Carbon Areal weight: 2000 g/m2 Fibre length: 50 mm Fibre: HS Carbon Nominal fibre volume: 57% Typical cure time: 20 minutes Remove HexMC®-i from freezer. Allow it to warm up to room temperature for easier handling. Clean the mould with appropriate solvent to remove all impurities. Apply external release agent. Heat the mould to 180°C. HexMC®-i curing time varies according to part thickness. Set press pressure to 80 bars. Modify pressure up or down according to the complexity of the part. Remove the protective film. Determine the part weight. Cut HexMC®-i to size accordingly. Staging step has to be done in oven to minimize resin/fibre separation and optimize the flow: 10 minutes at 180°C (can be adapted accordingly to part design) and then cool down the product to room temperature. Load the product into the mould. It is recommended that approximately 80% of the mould area is covered. Close the mould and apply pressure. Hold the pressure for the appropriate cure time. After curing, open the hot mould and release the part. A mould equipped with ejector pins is recommended to help

 Open the catalog to page 1
HexMC®-i / C / 2000 / M81-2

HexMC®-i / C / 2000 / M81 Note: HexMC®-i flow is greatly improved with temperature advancemant, typically by heating in an oven. Heat can be applied to HexMC®-i as it comes off the roll, after patterns are cut, or as preforms are made. The material is highly formable right after staging but becomes very stiff after cooling. Recommended staging and the complementary cure cycle for a 3mm thick panel is as follows: Staging: 10 minutes at 180°C (can be adapted accordingly to part design) and then cool down the product to room temperature. Typical cure cycle: 20 minutes at 180°C (can be adapted accordingly...

 Open the catalog to page 2
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.