MSP 300
3Pages

TECHNICAL DATA SHEET FIX300 - MSP300 Revision: 01/2011 Technical Data: Base Consistency Curing system Skin Formation(*) Cure Rate (*) Hardness Change In Volume Specific Gravity Adjustability Time (23°C & 50% R.H) Temperature Resistance (cured) Set to Load Bearing Tensile Strength Elongation At Break Application Rate: Page 1 of 2 Polymer Paste Moisture Cure Approx. 45 mins (23°C & 50% R.H) 3mm/24Hrs (23°C & 50% R.H) 35 Shore A < 2% 1.31g/mL Approx. 3 Hrs -40°C to +90°C Minimum 24Hrs 2.44 N/mm2 335% Depending on the substrate 3Kg/m2 by use of 4mm notched trowel (*) Values may vary depending on environmental conditions Product: Deckfix MSP300 is a high quality solvent and water free specialist adhesive sealant, suitable for adhering marine timber decks such as teak. Deckflex is also suitable for adhering Flexiteek, composite PVC based marine deck system, Stazo Marine deck 2000 and other cork decks such as Aquadeck. Deckfix MSP300 is suitable for bonding to substrates such as timber, fibreglass, aluminium, steel, concrete ceramic tiles and most other common substrates. Description: Deckfix MSP300 cures by means of chemical reaction within the adhesive. Once fully cured (approx 24Hrs, 23°C & 50% R.H) an elastic and non-shrinking adhesive layer is formed, which is resistant to moisture and heat. Deckflex has excellent adhesion to most common substrates within the marine and construction industries. Deckfix MSP300 contains no wtaer or solvents, minimising the risk of deforming any adhered decking Characteristics: - Single component, no mixing required - EC-1 label, very low emissions - Solvent free, contains no water - Free from toxins inc. isocyanates - Easy application - Forms stable peaks when applied by trowel - High final bond strength - Permanently elastic - Suitable for timber, PVC and cork decks - Verified as non-hazardous by NOHSC Substrate: Timber: before installation of the flooring, the substrate should be checked to ensure suitability. Check the moisture content for the entire thickness of the substrate with a carbide or electric hygrometer. The moisture content must be as recommended by the manufacturer and supplier. Typical moisture content of timber substrates should not be more than < 9-11% moisture content. Non-porous Substrates; Aluminium, Steel Fibreglass and other composites must be clean and dry before application. Abrade and clean Note: The contents contained in this documentation are the result of our experiments and our experienceand have been submitted in good faith. Because of the diversity of the materials and substrates and the real number of possible applications which are out of our control we cannot accept any responsibility for the results obtained. In every case it is recommended to carry out preliminary experiments and compatibility tests. Fixtech Pty Ltd. PO Box 568, Southport, Qld 4215. Tel: +61 (0)7 5530 1099. Fax: +61 (0)7 5530 1322 Email: info@fixtech.com.au Web: www.fixtech.com.au

TECHNICAL DATA SHEET FIX300 - MSP300 Revision: 01/2011 Substrate continued: with Methylated Spirits or alcohol cleaner. Deckfix MSP300 should be always be applied to an even, dry, clean and smooth substrate, which is free from irregularities and cracks. Old adhesives may affect adhesion and must be removed. Loose or damaged surfaces must be repaired before adhesive application. Powdery substrates must be pre-treated with appropriate sealers and repairing compounds as per the substrate manufacturers specifications. Smooth surfaces such as aluminium, steel, fibreglass should be abraded with...

TECHNICAL DATA SHEET FIX300 - MSP300 Page 3 of 3 Revision: 01/2011 Surfaces: State of Surface: abraded, clean, dry, free of dust and grease Priming: For porous substrates Primer PR10 may be applied. Polypropylene, Primer PR20. Nonporous substrates may be cleaned with Methylated Spirits , alcohol cleaner or wax and grease remover. We recommend a preliminary compatibility test. Resistance to Chemicals: Good resistance to water, aliphatic solvents, mineral oils, grease, diluted inorganic acids. Poor resistance to aromatic solvents, concentrated acids and chlorinated hydrogens Application:...