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The Next Generation of Core Materials - DIAB
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The Next Generation of Core Materials - DIAB


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Z E The Next Generation of Core Materials 4.0 GREATLY ENHANCED H GRADE > Strength increased by up to 15% ULTRA HIGH PERFORMANCE HP > High strength at elevated temp. 3.0 > Excellent shear characteristics > Greater thermal/dimensional stability (Mpa) > Better elongation to break & ductility > Exceptional peel strength 2.0 > Superior ductility & toughness 80 Kg/m3 100 Kg/m3 130 Kg/m3 Divinycell HP Divinycell H Divinycell HP Divinycell H Divinycell H 0 Divinycell HP Divinycell H Grade, which is intended for the majority of composite applications, has been greatly improved in all major performance areas. Compressive and shear properties (normally the most important property for a structural core material) have been increased by up to 15%. In addition Diviny. H 1.0 Divinycell HP > 50% reduction in cell size 200 Kg/m3 Shear Strength - ASTM C 273 With its high temperature resistance, Divinycell HP is ideal for prepreg processes as well as elevated service life temperatures. What is remarkable is that its strength and ductility has not been compromised in order to achieve its elevated temperature properties. The shear strength to strain values 4 3.5 3.5 3 2 Divinycell H60 1.5 Old X-PVC Foam 1 2 1.5 HP100 HP80 1 0.5 0.5 0 HP130 2.5 2.5 (Mpa) Load (kN) 3 0 0 10 20 30 Deflection (mm) 40 50 23°C 60°C 90°C Temperature (°C) Four Point Bending Load - ASTM C 393 Compressive Strength Vs. Temp. - ASTM D 1621 elongation to break has risen dra- are better than any other foam core material. Also HP has good ductile properties (energy absorption). HP’s peel strength values (adhesion) are equally impressive, showing excel- 2.0 1.8 1.6 Stress (MPa) matically by up to 65%. The excellent ductility and high fracture toughness of Divinycell H make it particularly ideal for applications that are likely to be subjected to fatigue, slamming or impact loads. Maximum processing and service life temperature have also been improved. Yet another major improvement is a 50% reduction in its cell size in order to reduce resin usage and thereby save weight. Divinycell H & HP 1.4 1.2 1.0 0.8 0.6 N.B. Below the curve is the energy absorption area. 0.4 0.2 0 0 5 10 15 20 25 30 35 40 45 50 Strain (%) Stress / Strain Curve - ASTM C 273 www.diabgroup.com lent compatibility with all commonly used epoxy prepregs. With its wide processing envelope, high strength at elevated service temperatures, good ductility and competitive price, Divinycell HP is ideal for a wide range of high performance applications.

pageCatalog pdf ne En 2012-05-21-24